Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig
Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of
Electronics Forum | Tue Aug 24 08:42:44 EDT 1999 | Chaim Krief
I am looking for information about SMT shields thcnology. Thats include Diecasting, Laser Cutting, Photo- Etching, Mechanical Enclosures & Stamping. Shilds types : Mechanical Structure,Pick up options,plating etc.
Electronics Forum | Thu Apr 22 02:25:29 EDT 1999 | Ron Lahat
I'm looking for a book that contains all electronic component manufacturers Logo's and their P/N structure This book is needed by our QA/QC personal
Electronics Forum | Sat Dec 06 07:37:46 EST 1997 | Raymond
Are there any good books on TPM (Total Preventive Maintenance) ? I am trying to set up a good maintenance structure/system in my company to maintain the SMT equipment. Any suggestions will be appreciated. Thanks.
Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef
Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den
Electronics Forum | Wed Jan 15 19:27:43 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Wed Jan 15 19:27:44 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Tue Jul 08 18:37:54 EDT 2003 | MA/NY DDave
Hi AlC, Q: Who calculates Cp, Cpk. It depends on the company, it's size and structure. Some expect the SMT / Process Engineer to do this work and others have all kinds of other groups involved. YiEngr, MA/NY DDave
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
