Electronics Forum | Wed Jun 05 17:14:40 EDT 2002 | davef
First, I suggest that people search the SMTnet Archives in just about every response that I make. Second, you need to work on your DOE jargon * Factors. Independent or input variables * Effects. Results. Dependent or output variables. Third, the
Electronics Forum | Mon Oct 14 17:28:08 EDT 2002 | msimkin
Russ, Thanks for the feedback. Yeh, we are placing them in production using a full ball detect Yamaha placement machine, 5 thou square stencil. etc.etc. The only reason I raised this concern was from a rework point of veiw (actually, the board desi
Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef
When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied
Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Sat May 29 15:58:37 EDT 2004 | Patrick Tarell ... Automation Engineering Jabil Circuit
Hello Alan! We have used both chipshooters, we also have a Mydata with the hydra head... We switched entirely from Fuji CP7 to the UIC HSP4796 and now HSP4797. The CP7 is a nice machine but we were very unhappy with the support structure within Fu
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
Electronics Forum | Tue Dec 13 14:55:12 EST 2005 | muse95
Your response is from the point of view of using a Bismuth solder with Pb plated leads. Samir's point of view is from Bismuth in the plating on the leads being used with a Pb solder. There is a very large difference in the amount of Bi that will en
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Tue Feb 28 14:32:26 EST 2006 | masrimhd
As I know, the encapsulation effect occurs only with rosin based fluxes. So if you have a PBA soldered using RA Flux, you should either wash it well, or leave it alone and it will be safe. For NC process the story is different because there�s no re
