Electronics Forum | Fri May 26 10:58:15 EDT 2006 | Chunks
Tell your inspector you are PURPOSELY printing 25% off to attain a synergistic energy level that will initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning co
Electronics Forum | Mon Aug 21 11:58:54 EDT 2006 | Chunks
I believe you need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are e
Electronics Forum | Fri Sep 08 16:12:38 EDT 2006 | Buzz
NO! We need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are establi
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Thu Dec 07 11:49:28 EST 2006 | K
We currently have RMA and WS soldering processes here and do batch cleaning for both. We are experiencing some capacity issues and are interested in looking at an IN-LINE aqueous wash. My experience with in-line wash is only with WS. 1. Since RMAs
Electronics Forum | Mon Apr 23 09:37:20 EDT 2007 | davepick
Assuming you are going to build using a Leaded part on a Lead Free Process - beware of Weak Joints. I saw this at a large Multinational company - They had secondary reflow on a Top Side QFP when the PCB went over the wave. We did pull strength tests
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
Electronics Forum | Tue Jun 12 14:29:01 EDT 2007 | realchunks
You'll need to calibrate your effectiveness to the deliverables of the adhsive quality and initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor spec
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
Electronics Forum | Tue Aug 28 11:08:42 EDT 2007 | dphilbrick
Dedicated fixtures are always better, assuming you use a good manufacturer. If your a CM you will always have a battle convincing customers to pay for dedicated fixtures unless you have a detailed cost structure that can show them how they will save
