Electronics Forum | Fri Mar 28 21:37:11 EST 2003 | MA/NY DDave
Hi Are all the other solder joints for the other components other than the MELF not having a problem. That is what you said, yet I wanted to check?? To say a less twisted way is this only with the MELFs and is it with all the MELFs?? If you have
Electronics Forum | Wed Jun 18 09:43:42 EDT 2003 | blnorman
We have a line that is double sided reflow and reflow/wave depending on the product being manufactured. We asked Loctite if we could cure our chipbonders with the reflow profile to eliminate having to change oven profiles for each. They said we wou
Electronics Forum | Thu Sep 25 22:36:41 EDT 2003 | fastek
It wasn't that long ago that your beloved UIC was attempting to charge $20K to license a GSM. Are you saying they don't have a license fee structure any more? I bet they still do. I feel the fees charged by the SMT OEM's are justified as many are as
Electronics Forum | Mon Sep 29 02:35:28 EDT 2003 | Sam
Hi Mantis. Has there been any changes in the BGA itself? One of our BGAs changed to a newer type, and after that we had problems with corner lifting. In that case problem was BGA's structure, there was mismatch in TCE between BGA's substrate and mo
Electronics Forum | Wed Jun 02 10:10:42 EDT 2004 | Dreamsniper
Can someone who has experience with the above share his knowledge in programming the X-Y coordinates, is it in text format, .csv etc? What's the structure of the program in columns(e.g Description, Part No., X,Y,R)? Is the "FlexProg.exe" program com
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Thu Jun 23 13:43:29 EDT 2005 | Stefan
I fear your files are not stored in the default directory or your hard drive is full. Boot with a DOS boot disc and check your C drive for program and fiducial information. Try an older program to check if the program structure and vision informatio
Electronics Forum | Mon Feb 19 08:00:46 EST 2007 | ck_the_flip
Darby, thanks for the good info. I actually read an article is Circuits Ass'y that a more rapid cooling rate results in "better diffused tin rich clusters" resulting in better grain structure. But...this article was written by an Oven manfuacturer
Electronics Forum | Sat Jun 23 07:34:26 EDT 2007 | davef
This sounds like a form of corrosion called electromigration. It creates cathode anodic filaments. They have a fern like shape because it is a metallic based crystal structure. Electromigration requires: * Difference of electrical potential * Chemica
Electronics Forum | Mon Sep 17 19:06:55 EDT 2007 | davef
We have TR-460A. We do not use it very often, because of the level of experience of our troop. It is useful for companies looking to develop, structure, and organize their wave soldering process troubleshooting skills. The information in TR-460A is n
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