Electronics Forum | Thu Jul 05 11:26:22 EDT 2007 | cokedigits
i defagree
Electronics Forum | Mon Jul 09 06:30:22 EDT 2007 | reypal
Thank You Guys for all your feedback, comments and linkage.
Electronics Forum | Thu Jul 05 00:23:50 EDT 2007 | reypal
Im not sure if someone has posted this topic before. Anyway,we plan to make capability study on our wave-soldering machine but we have no experience on how to do it effectively. My question is what we should consider most among the critical parameter
Electronics Forum | Thu Jul 05 10:32:56 EDT 2007 | realchunks
WRONG! Actually I was going to say the same thing but figured I would have the standard 3 people dissagreeing with me, and or correcting me. I do believe your wave solder temp should remain a constant temp and prolly will not vary at all, so I woul
Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip
The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)
Electronics Forum | Thu Jul 05 21:46:53 EDT 2007 | davef
Here are the basics of determining that your process is in control and capable - http://lorien.ncl.ac.uk/ming/spc/spc9.htm There are tons of stuff like this on the web.
Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir
Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process
Electronics Forum | Mon Jul 09 10:00:29 EDT 2007 | davef
DB Comments on things that should be set and controlled and not adjusted are: * We agree that pot temperature should be excluded. * We'd like you to add parallelism to your list of items to exclude from CK's list. It's given that parallelism is impo
Electronics Forum | Thu Jul 17 14:30:42 EDT 2008 | tommyg_fla
1500 lbs) vary by a couple of degrees) were standard. I thought that flux penetration into PTH barrel and solder pot immersion depth and solder pot parallelism would be also critical factors. We are using the ECD WaveRider to measure the implied sold
Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef
Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches
