Electronics Forum | Mon Dec 09 21:00:54 EST 2002 | MA/NY DDave
Hi DaveF, Well I don't agree with the process, depending on job, since the management of the workers output gets more complex. Boy would I be killed some places for writing the "No Music" policy. Personal Headphones are better than Speakers since th
Electronics Forum | Mon Apr 12 22:50:46 EDT 2004 | davef
For more information on flame retardents, try these sites: * http://www.bsef.com * http://www.firesafety.org For the summary of a study into flame retardants try: http://www.surrey.ac.uk/PRC/ IVF carried out an international study on alternati
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Tue Sep 19 22:15:53 EDT 2000 | Sophia
Hi guys, I have been working in the SMT pick and place process for five years, and now I'm responsible for the solder paste printing process, and one thing that I notice is that the actual process that we have is to poor, actually our main defects a
Electronics Forum | Thu Mar 22 03:26:42 EST 2001 | moseschee
Hi Dave, Thank you for your reply.It means a lot to me. By the way, is it possible to have the analysed data on the study you mentioned regarding the solderability "conditioning " ? Can we establish the correlation of solder shelf life based on y
Electronics Forum | Fri Oct 09 17:18:22 EDT 1998 | David Spilker
| I am looking for data on share of SMT components in the total components market. I would like to quote in a study on how many boards are manufactured completely in SMT and how many are in mixed technologies. I would like to show the developpement o
Electronics Forum | Wed Jul 15 13:33:56 EDT 1998 | Don Welling
I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress diff
Electronics Forum | Thu Feb 19 12:52:08 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? My specifications require rejection and study if voiding exceeds 2% of solder joint volume measured using x-ray and/or x-sectional analysis. My
Electronics Forum | Mon Dec 08 16:10:02 EST 1997 | Donnacha Nagle
Q1. As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. Ultimately I will be setting up control charts on line. Does anybody have suggestions in this area ?, I have alot
Electronics Forum | Mon Sep 17 14:57:11 EDT 2001 | ert002
We are printing 0.012" apertures on a .012" Solder mask defined pad in a fine pitch BGA application. The board is 0.032" thick with very little room on the bottom to place support pins under these areas. Our first pilot proved extremely difficult to
