Electronics Forum | Tue Jul 19 05:00:07 EDT 2005 | aj
Guys, Are sub-contractors responsible for WEEE directive. aj
Electronics Forum | Tue Apr 27 06:35:33 EDT 1999 | Dan
Using moss fets attached to sub heatsink and hard coat anodizing sub heatsink at higher cost and erratic performance. Looking for thermal tape, insulator to replace hard coat that will prevent shorting.
Electronics Forum | Wed Sep 05 02:05:47 EDT 2007 | jepoy
What are the status of the LEDs? Are these LEDs lighted up in RED? If so, the harddrive and the sub are disabled. You can enable these if you have the system disc. Insert the system disc, then, $ sign will appear. Type hdstat. This will display the s
Electronics Forum | Mon Jun 30 00:50:57 EDT 2008 | benefon
Hi There are many ways of doing this but I usually transpose the coordinates to the lower right hand corner of the sub-panel that is situated at the lower right hand corner, because the reference point of the machine is the right hand side locate pi
Electronics Forum | Wed Dec 03 21:10:06 EST 2003 | Dean
ohm out a sandard 25 pin d-sub. Make wire diagram. do the same to the lsm cable. If same, use standard cable. If different, buy cable and solder lug d-sub connectors and make your own cable. couple hours work.
Electronics Forum | Fri Sep 02 10:10:54 EDT 2005 | Mity-C
We had a customer who came in to discuss a solder adheasion problem on some sub-assemblies we were building for them. When they arrived, they put a sub assembly in a vise and hit it with a hammer. I was speechless to say the least...... C
Electronics Forum | Tue Jul 19 21:07:29 EDT 2005 | davef
No, the people that put products on the market are responsible for WEEE.
Electronics Forum | Fri Jul 29 19:34:26 EDT 2005 | Jason Fullerton
WEEE = Recycling Initiative RoHS = Lead-free
Electronics Forum | Tue May 07 22:41:32 EDT 2019 | pcbindex1
PCBs applied in vehicles are the fastest growing sub-industry
Electronics Forum | Thu Aug 16 04:35:10 EDT 2012 | craigweir
Can anyone advise on the risks involved in using a (previously soldered) component, in this case an 'SOIC8', as pick-up area for subsequent pick/place operation of sub-assy to larger motherboard ? The sub-assy in question would be a small outline(25
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