Electronics Forum: success rate (Page 1 of 7)

BGAs and vapor phase

Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY

Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi

BGA Pad damage

Electronics Forum | Fri Dec 08 09:48:11 EST 2006 | SMTRework

Hi Guys / Gals, just curious as to how some of you approch BGA pad damage? (ie broken or lifted pads) Also, what kind of success rate have you found with your method?

BGA corners curling up during rework install...

Electronics Forum | Fri Oct 27 08:53:25 EDT 2006 | russ

I thjink you should bake these parts for 24 hours at 125C I used to have this problem and I even think it was the same package to be honest. Since we started baking all BGAs for rework process regardless of "condition of storage" we have increased

Repairing balls on BGA's

Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc

Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 16:05:24 EST 2008 | dphilbrick

At one point in time we were putting TI NanoStar parts on these particular boards. You don't want to attempt this at home! Thank God they took them off. Part was 1.45 X 1mm with 6 .1mm balls. They were a pain in the A$$. We had about a 90% success ra

Re: paste in hole

Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies

Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi

OSP vs HASL

Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.

Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The

0201

Electronics Forum | Fri Feb 22 13:24:24 EST 2008 | mulder0990

How did I know senior was going to get in here too. Nice to see you again. I figured as much with the height difference, but I do not have the equipment here to test my thoughts. We somehow have our machine dialed in to run the 0201 parts with W

Vibration Feeders

Electronics Forum | Mon Sep 29 16:20:08 EDT 2014 | rgduval

Our success rates with MyData vibe feeder were always tentative. Sometimes you'd get it to go great, sometimes, not so much. MyData allows you to control frequency and amplitude on the vibration. Trying various combinations of the two was key to g

BGA Rework affected by cold weather?

Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera

HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s

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