Electronics Forum | Thu Dec 30 21:51:47 EST 1999 | Dave F
Jason, if you're considering: * "Stacking" components, it's a bad idea because you're reducing the surface area of the lower component, which is required for heat (power) dissipation. * Multiple components side-by-side or end-to-end, it acceptable
Electronics Forum | Tue Dec 14 15:21:41 EST 1999 | BJL
This may be the nickle paladium lead material or an 87/13 tin lead plating on the leads. Paladium and 87/13 has a slower disolution rate and takes longer for solid joint to be created between two metal surfaces. Reflow temp must allow the joint to be
Electronics Forum | Tue Dec 14 12:41:56 EST 1999 | Kris W
Glen, Although the previous answers probably fit the problem you are having, we recently found that during pin insertion on an Autosplice machine, the gold was flaking from the pins and lodging between the legs of surface mount components. It would
Electronics Forum | Wed Dec 08 23:53:35 EST 1999 | Mike Eskridge
Yes, there are several conveyor companies that make a conversion box for SMP1 to SMEMA and SMEMA to SMP1. Basically they are just to differant standards for cable conections between machines. SMEMA stands for Surface Mount Equipment Manufacturers Ass
Electronics Forum | Tue Nov 09 13:20:21 EST 1999 | Dave F
Chuck: Try: 1 WWW.JEDEC.ORG 2 Search "surface mount package" which gives you ... MO-Index INDEX OF MO OUTLINES IN PUBLICATION NO. 95 BY-FAMILY INDEX OF REGISTERED MICROELECTRONIC (MO) OUTLINES (contains description of the content of each file) Goo
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William
I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a
Electronics Forum | Wed Sep 08 20:38:06 EDT 1999 | Barbara
I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
Electronics Forum | Mon Aug 16 05:09:30 EDT 1999 | Charles Stringer
Atlthough not strictly surface mount, I am sure that amongst the experienced players out there someone will have some answers for me. Does anyone have any experience of "phase change" heatsink materials. These are solid at room temperature and then t
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