Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
Electronics Forum | Tue Jun 07 20:56:47 EDT 2011 | aoiguy
Any and all input will be greatly appreciated. So here it goes. I'm having an issue where the cad I'm getting from customers is referencing pin 1 as the parts placement. This isn't an issue for surface mount, however the aoi machine that we have in
Electronics Forum | Tue Jun 28 20:35:16 EDT 2011 | smellew
Hi you can buy the motors individually direct from Siemens or others suppliers like ourselves SME(Surface Mount Engineering)also many other uk & EU dealers(STM, Adopt, AMS,ISS & CPS, just search you'll find them plus many china suppliers, (Left side
Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke
We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Mon Jun 04 23:52:57 EDT 2012 | rway
Actually, if you experience lack of witness marks, you probably have a problem. Witness marks are OK and will not affect your assembly. I assume this is an SMT assembly we are talking about, in which case, this is what your test pads are for. You
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
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