Electronics Forum | Fri Apr 29 08:28:17 EDT 2011 | markhoch
Is it possibly being caused by surface contaminants on your PCB? Or possibly flux residue? Is this a one time occurance, or are you seeing it regularly? Is it happening in other areas on your PCB or in just this location? Can you please provide more
Electronics Forum | Wed Sep 05 17:14:39 EDT 2012 | cpitarys
All that is required is the sample surface area. (LxWx2) Ref, IPC-TM-650. 2.3.26.1
Electronics Forum | Fri Sep 06 16:24:36 EDT 2019 | linux
We use similar switch and the same oven. You need to modify the stencil, increase surface area. Have modified all our stencils to the point where we no longer use inline glue dispensers for any product
Electronics Forum | Thu Apr 07 15:42:29 EDT 2022 | SMTA-69080803
@ProcEng1 Yes... something like that. However, how do I ensure that the adhesive will always stay on one material assuming that the surface area is the same?
Electronics Forum | Thu Oct 14 08:01:48 EDT 1999 | JohnW
Gee Dave That's the first time I've ever seen myself listed for a quote! Brian, what your saying is on the whole right, on the surface of it the mask, as long as it's cured properlay shouldn't make a difference but I have to say that I've found so f
Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi
Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Fri Aug 21 07:57:20 EDT 1998 | Earl Moon
| | | Will somebody please explain HASL (here). Thanks. | | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F | You do this to keep the green s
Electronics Forum | Wed Mar 11 10:58:58 EST 1998 | Earl Moon
| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination
Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ
Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme
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