Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
Electronics Forum | Thu Dec 30 21:51:47 EST 1999 | Dave F
Jason, if you're considering: * "Stacking" components, it's a bad idea because you're reducing the surface area of the lower component, which is required for heat (power) dissipation. * Multiple components side-by-side or end-to-end, it acceptable
Electronics Forum | Wed Jul 21 13:05:17 EDT 1999 | John
Looking for a cross-referencing and part identification guide for surface-mount components. There is very little infomation provided on some of the components themselves, and we often don't have parts lists or schematics for items we repair, so ident
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Electronics Forum | Wed Dec 10 14:37:47 EST 1997 | Frank Murch
There is a direct relationship between adhesive strength and surface area. If you graph this it will be linear. The amount of the adhesive should be about 2/3 the gap between the pads. Pad designs change all over so a true and tried rule does not ex
Electronics Forum | Fri Sep 06 13:49:17 EDT 2002 | soupatech
Question: I am going to start placing 3mm x 3mm plastic smt leds and want the absolute lowest errors caused by the nozzle either dropping or allowing the part to shift. Would a 2.5mm nozzle be too big for the 3mm part. My logic is that the more surfa
Electronics Forum | Fri Sep 13 14:35:03 EDT 2002 | davef
Thanks Bernard. On your profile: Adding gold to your solder alloy will increase the liquious temperature. So slowing your reflow oven conveyor is a perfectly reasonable approach, especially for pads with low surface area. We don't even notice a di
Electronics Forum | Fri Dec 20 17:01:23 EST 2002 | davef
The rice and soup mix illustrate the point that you probably should NOT be using the lead shot mentioned in the initial post on this thread. The oxide powder on the lead shot could work its way to the surface of the "bag", get onto troops' hands, an
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Fri Jun 27 14:52:00 EDT 2003 | davef
Running a spare board with each job would be expensive. Consider running boards: * That were scrapped by your fabricator. * Without components. Admittedly you loose a measure of the contamination provided by your component suppliers, but if it's a
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