Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa
Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be
Electronics Forum | Thu May 12 07:27:51 EDT 2005 | Frank56
Hi Amejia, Do you can try my silly idea by using some connector header with plastic holder type cut and preparation by number of pin same as number of hole you want to mask and insert thru the pcb hole before you coat or may be you can use some type
Electronics Forum | Thu Nov 09 23:01:34 EST 2006 | davef
Tin/lead alloys tend to oxidize very easily, affecting solderability. Use the largest particle sized paste possible, because as the particles decrease in size their total surface area per unit mass increases, effecting: * Demands on the flux increase
Electronics Forum | Mon Sep 12 07:03:26 EDT 2011 | mosborne1
Can you post a picture? There are many reasons why they probably don't fill. There needs to be a larger surface area on the ring on top. There could be debris in the via holes from not properly drilled or cleaned before plating process. Your customer
Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani
Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha
Electronics Forum | Wed Aug 07 16:06:26 EDT 2013 | rway
What type of filtering are you using? Your solder inspection should be using Histogram Inspection as the Decision and red filter for preprocess. Make sure your settings are correct and check your binarized image under Histogram setup. you should s
Electronics Forum | Fri Jan 10 03:40:41 EST 2020 | jakapratama
Hi, Some nano coat supplier said that you can drop water to the surface where the coating supposed to present before to check. If it's beading, it's still there. I take it that you meant by self in-house wiping of coating, yes? Stencil supplier nan
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Tue Jun 14 08:37:18 EDT 2005 | jdumont
Morning all, just took a look at a new board we just got in and the there are different pad areas under the same BGA. What happened is engineering uses wider trace sizes for some pads and those overlap when more than one go to the same pad. This caus
Electronics Forum | Tue Apr 24 09:19:51 EDT 2018 | vetteboy86
Is there a preferred method among printed circuit board assembly for accurately and quickly verifying the copper weight of a printed circuit board? I would like a tool and process that our quality inspector could quickly use to verify upon receipt of
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