Electronics Forum | Tue May 15 11:55:16 EDT 2001 | dason_c
We had a same problem before and Cirtech work with FAB supplier. It is due to the contamination on the tank. No special profile and paste use on the immersion tin board. Dason
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam
Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..
Electronics Forum | Fri Nov 16 10:53:30 EST 2001 | Carol Stirling
Hello Everyone, Our board supplier changed our board surface finish on a prototype to flat solderable tin (FST) because of the PWB thickness (.125"). The pads seem to be contaminated, particularly on second side pass through reflow. The solder appea
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Mon Jul 28 11:22:46 EDT 2008 | blnorman
Iagree with Matt, normally caused by pad surface contamination. Out of curiosity, what is the PCB metallization?
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
Electronics Forum | Fri May 18 13:08:19 EDT 2012 | blnorman
I'll chime in here as well. If you have adhesion problems, 90% of the time it's contamination on the substrate (soldermask, flux residues, cleaner residues, etc.). Like Dave said, omega meter is a test for gross cleanliness, and it's OK for process
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