Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Fri Apr 29 08:28:17 EDT 2011 | markhoch
Is it possibly being caused by surface contaminants on your PCB? Or possibly flux residue? Is this a one time occurance, or are you seeing it regularly? Is it happening in other areas on your PCB or in just this location? Can you please provide more
Electronics Forum | Tue Feb 22 02:51:25 EST 2022 | davef
The industry standard for Resistivity of Solvent Extract (ROSE) Testing analysis is IPC-TM-650 Method 2.3.25 – Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE).
Electronics Forum | Fri Feb 05 14:29:14 EST 2010 | kaz
the board in question is from Foba Laser Engraver, it's a surface contamination coming from.. everywhere, a lot of moving parts that are lubricated. I'm now studding chemicals that we may use for our kind of rework & cleaning. We may think of modifyi
Electronics Forum | Tue Feb 28 07:53:28 EST 2006 | amol_kane
some coatings are more forgiving to surface contaminations than others. best way to go about is select some coatings with the properties you need and then trial the boards to see any coating defects (like dewetting, pinholes, flaking etc) wiping wit
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt
We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we
Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef
I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
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