Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Wed Nov 06 10:03:59 EST 2013 | rgduval
Hi, Peter, I'm not an authority on surface finish thickness, and it's effect on reflowing, so, I can't advise on that front. If the boards are a week old, and ENIG, I would not suspect surface contamination. It's always a consideration, of course,
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Mon Apr 15 22:37:27 EDT 2002 | davef
Regarding your customer suditor, it would have been nice if you said something like ... Routinely, our testing shall be less than 1.56 microgram/cm^2 NaCl equivalent ionic or ionizable flux residue, according to TM-650, Method 2.3.35 'Detection And
Electronics Forum | Mon Feb 24 15:14:21 EST 2003 | blnorman
Having worked with adhesives for years, the first thing to look at if there is a failure of this type is surface contamination. The subject has been discussed here also. A structural adhesive will increase in strength with a "hotter" cure. We also
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh
Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe
Electronics Forum | Mon Jul 01 11:29:02 EDT 2013 | hegemon
I am guessing a lead free process. From the pictures, I don't neccessarily see any issues, perhaps the leads have wicked up a little too much solder, making the joint look a little starved. But I think I see nice toe and side fillets. In the worst c
Electronics Forum | Thu Jun 20 05:50:29 EDT 2002 | edahi
thanks yeah we are very much looking at the reflow because the package is ceramic tough "scratch" the tape idea because the gold pad is a marking area and the surface might be contaminated and it might cause illegible marking. the slow ramp up i'll
Electronics Forum | Mon Jul 28 05:48:17 EDT 2008 | mattkehoe
What could be the main reasons for De-wetting in > reflow process. Can anybody answer Normally it is a contaminated surface finish.
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