Electronics Forum | Mon Sep 19 08:36:53 EDT 2005 | lloyd
I had a similar problem a few years ago when glue printing. Our production environment wasn't to clean room standards and there was a bit of air born contamination floating around which would gather on the PCB surface (also our rough board edges wou
Electronics Forum | Sat May 16 19:31:27 EDT 1998 | Graham Naisbitt
Gentlemen, Please consider that ionic testing is designed only for detecting ionic contaminants. Yes there are instances of non-ionic contaminants that cause premature circuit failure. However, more importantly the prevailing specs are less than adeq
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Mon Aug 19 11:36:27 EDT 2019 | bulur
How does no-clean flux residues on a PCB assembly impact the ROSE testing? Does no-clean flux residues on the PCBA dissolve in solution of ROSE tester and increase ionic contaminants level in terms of NaCl per surface area? Is ROSE tester solution (a
Electronics Forum | Wed Mar 30 14:02:25 EDT 2016 | blnorman
The program I'm working on is having endcap metallization/resistive element failures. These are on MELFs manufactured by IRC/TTE (MCHP). A sister program is having the same issues. They pulled a couple of date codes and did visual examination and
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Wed Aug 15 16:14:22 EDT 2001 | davef
Comparative Tracking Index [CTI]. In printed circuit board fabrication, CTI is a measure of the ability of the laminate surface to withstand tracking [carbonneous tracks on the surface, under wet contaminated conditions] across two electrodes placed
Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach
| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c
Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin
| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
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