Electronics Forum | Wed Jan 19 08:40:53 EST 2000 | Wolfgang Busko
Hi Erico, I think it�s just a naming problem. Under the topic of tombstone there are a lot of causes for different appearances of this symptom. Shouldn�t be always the errected position that occurs. In your case it seems that either the components so
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Thu Oct 10 21:41:38 EDT 2002 | surachai
No need to change solder pot ,anyway the contamination during clean and no clean flux may happen when change from clean to no clean which it will float on the surface of solder pot , you only clean it ( same as the dross removal ) due to in the norm
Electronics Forum | Fri May 15 18:09:00 EDT 1998 | Earl Moon
| | | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | | We h
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Tue May 11 07:50:52 EDT 1999 | Graham Naisbitt
| If I clean my assembly and find no visable contamination with the unaided eye, do I need to do cleanliness testing prior to conformal coating? | Douglas, It is highly advisable to test for ionic contaminants because a coating seals in as well as
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