Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Fri Jun 03 10:04:51 EDT 2016 | sara_pcb
I am planning to attach 1760 pin BGA. The pitch is 1mm and Balls are SAC alloy type. The PCB is for aerospace use and expected to work in harsh environment. What is the recommended PCB surface finish and the attachment process for such a applicatio
Electronics Forum | Fri Apr 30 09:32:42 EDT 1999 | Steve Gregory
| | |Hi all | | This Debate on lead free soldering is really hotting up here in Europe. From 2004 the use of lead in components and assemblies will be banned here. Also flame retardent halogens will be banned(FR4 etc). While we all agree that we hav
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
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