Electronics Forum: surface mount home plate design tombstone (Page 1 of 6)

Home plate aperture holes

Electronics Forum | Mon Jul 16 14:38:22 EDT 2001 | ohboy

If your pad designs don't meet IPC recommendations, using home plate may have adversely affected the (possibly marginal) placement tolerances. This could also be caused by an incorrect home plate design, which IPC has also given recommendations for,

0402 aperture design lf

Electronics Forum | Mon Apr 16 09:13:16 EDT 2007 | pjc

Tombstone head and a graveyard mind. I would not recommend 1:1 due to solderpaste beed out opportunities. Have you tried the inverted home-plate? Here are some good links on tombstoning and how to eliminate it: http://www.aimsolder.com/technical_ar

Best Land Pattern design for 0402 Resitors?

Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin

I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad

0402 tombstones

Electronics Forum | Tue Apr 21 16:33:06 EDT 2009 | llaerum

Home plate design is great for avoiding beads and tombstoning in some cases, but it will not help you when the spacing is too far apart. It will make it worse. You need a good even screen and accurate placement.

Tombstoning issues!!!

Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip

Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer

Lead Free Stencil Design

Electronics Forum | Wed Jul 13 14:56:53 EDT 2005 | jdengler

I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on r

Re: Tombstones

Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW

| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto

Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca

Re: Tombstones

Electronics Forum | Thu Aug 06 12:16:52 EDT 1998 | Rin

| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon

| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d

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