Electronics Forum | Tue Apr 13 23:35:44 EDT 1999 | Jeff Sanchez
| | Hello. | | | | I'm now investigating the current technological issues | | on surface mount devices. | | For example, I want to know the limitation of | | the surface mount machine. | | | | Where can I get the materials for this purpose? | |
Electronics Forum | Tue Apr 13 23:41:15 EDT 1999 | Jeff Sanchez
| | | Hello. | | | | | | I'm now investigating the current technological issues | | | on surface mount devices. | | | For example, I want to know the limitation of | | | the surface mount machine. | | | | | | Where can I get the materials for thi
Electronics Forum | Wed Jul 15 13:33:56 EDT 1998 | Don Welling
I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress diff
Electronics Forum | Tue Apr 13 09:50:18 EDT 1999 | Dave F
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Cho
Electronics Forum | Fri Jul 17 11:57:25 EDT 1998 | Justin Medernach
| I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress di
Electronics Forum | Sun Feb 06 20:22:32 EST 2005 | smtequip
Hi Brad - You have just opened Pandoras box. EVERYONE seems to have their own favorite machine for their own reason, and I imagine you will get an opinon from just about everyone. I have represented several lines of equipment new, and now am in the
Electronics Forum | Wed Apr 07 12:07:54 EDT 2004 | davef
Q1: What are the main implications in changing an assembly production line from pin in hole to one based on surface mount technology? A1: The main implications in changing an assembly production line from pin in hole to one based on surface mount te
Electronics Forum | Wed Apr 07 10:19:04 EDT 2004 | Fraser Law
Hi, I am a graduating student looking for information on building my own business in the electronics industry and am looking for a gap in this market. Could you help me with the following issues, what are the main implications in changing an assemb
Electronics Forum | Mon Apr 30 00:49:07 EDT 2007 | Ron Rumrill
Let me chime-in regarding impact pressure. By definition, impact pressure is determined by several factors: 1. The weight of the water (a constant) 2. Its velocity (determined by the GPM and nozzle�s orifice size) 3. The area impinged (determined
Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo
Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil
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