Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef
We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more
Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini
Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards
Electronics Forum | Fri Nov 07 03:46:09 EST 2014 | philc
Just wondering why you need to scuff the surface at all, as a decent glue should take to the PCB material anyway. However, it may be a customer requirement, so you have to do it. Have you thought about getting the PCB's made with a rough surface wh
Electronics Forum | Mon Oct 25 07:44:18 EDT 2004 | adanhn
I agree with DaveF and Rob.Also check the nozzle for any rough surfaces. Good Luck.
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Wed Apr 12 09:33:10 EDT 2006 | jdengler
We had a similar problem and needed to slow the cam speed. The surface of our component was rough so I suspect we did not get a good seal for the vacuum and the component was drifting on the nozzle after the camera. Jerry
Electronics Forum | Fri Aug 30 04:53:08 EDT 2002 | jason
Hi Dr Lee, Recently, I was assigned to use Ag imm. PCB using 63/37 solder paste without Ag. The results were not fantastic. Surface finish was rough and lots of wetting issue. The oven profile soaking time was set at 70 secs above 183�C and Max tem
Electronics Forum | Fri Jan 16 12:03:46 EST 2009 | black5629
We are encountering similar problem as yesterdays posting, with solder not sticking to the pads but wicking to the leads on Leaded HAL finish boards, except we have tried two different solder paste lots with similar result. The oven profile and paste
Electronics Forum | Wed May 03 15:00:44 EDT 2006 | patrickbruneel
It all depends on process, design and environment in which the contacts are used. Both have excellent conductivity characteristics Both don't oxidize over time On the other hand gold is much softer then carbon, and after hitting that contact a gazil
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