Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Wed Jul 29 17:43:26 EDT 1998 | Steve A
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Wed Mar 24 09:22:16 EST 1999 | justin medernach
| We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any h
Electronics Forum | Wed Jun 16 15:44:52 EDT 1999 | Jagman
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Wed Nov 09 10:08:42 EST 2011 | julien
Hello all, We have an old batch cleaning machine in our production and we use isopropanol alcohol during the rinsing process probably to lower the surface tension. Right now we are looking for a new machine who can do a better job compare to the ol
Electronics Forum | Tue Dec 11 11:59:00 EST 2012 | sarason
The issue is surface tension around the connector. Your tip needs to have more surface tension than the pins of the connector as it forms a cluster when being soldered. When I used to solder superfine connectors with a metcal iron it had a horses hoa
Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak
We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin
Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Mon Dec 18 22:36:37 EST 2000 | Charles Harper
The major problems are poor layer to layer bond strength(due to surface tension of most fluoropolymers),and poor cold flow,or dimensional creep of these materials.Please also click on Chapter Author Konsowski,listed above.E-mail form will pop up when
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