Electronics Forum | Tue Nov 29 12:53:56 EST 2005 | bschreiber
Hello Billy, You are correct when you say that you may want to look at the detergent (chemistry) you're adding to the stencil wash. However, "geared for epoxy removal" depends on how the chemistry is designed to remove the epoxy. If it is a "water
Electronics Forum | Wed Mar 15 17:37:30 EST 2006 | Dan Feinberg
Greetings all, Dross has no value to the assembler. It actually degrades quality as a clean solder pot provides a more consistent process. Yes, removing dross does remove some metallic contaminates but that is overkill, like throwing away your refrig
Electronics Forum | Thu Mar 16 10:55:23 EST 2006 | Baer
I can tell you that I have been involved in new process chemical introductions for 40 years. I have seen a lot of claimes and this is one of the best inovations I have seen. If I was not convinced of this I would not be involved. As for process impr
Electronics Forum | Wed Oct 10 13:51:08 EDT 2007 | petep
Coilcraft has posted the following and I am wondering how you folks are handling the use of coils in a Water Soluble world. PCB Washing and Coilcraft Parts Coilcraft tests for resistance to solvents per the following specification: Resistance to s
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Wed Aug 18 05:09:56 EDT 1999 | Brian
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Thu Apr 29 10:02:07 EDT 1999 | Chrys Shea
| Anyone using hot air nife for wave soldering process. | Does it work? | Does it really eliminate solder bridging and does it create any other problems? | | any feed back will be much appriciated. | | Thanks | | Tony A | | Tony, The hot knif
Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES
| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
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