Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef
To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21
Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem
Electronics Forum | Tue Dec 13 14:55:12 EST 2005 | muse95
Your response is from the point of view of using a Bismuth solder with Pb plated leads. Samir's point of view is from Bismuth in the plating on the leads being used with a Pb solder. There is a very large difference in the amount of Bi that will en
Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar
5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh
Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef
Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
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