Electronics Forum | Thu Aug 21 08:59:05 EDT 2008 | rway
I would say yes. I don't believe that ICT will every be replaced by boundary scan. Now on some assemblies, boundary scan is viable and certainly a better choice considering test access constraints. But ICT still will play a vital roll in the futur
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Wed Jan 09 10:39:41 EST 2002 | caldon
Remeber Do not use any probes or fixtures to hold the lead down while soldering or rework .....this is a bad idea. I would remove the component and replace or gently push the lead back into coplanarity and resolder. This all can be done at most rewor
Electronics Forum | Wed Jul 11 14:45:22 EDT 2007 | samir
ECD, KIC, or any mfgr. of thermal profiling devices will charge a premium for "simple stuff". For example, ECD charges a grand for their "flux-o-meter", which is just a PCB with a hole pattern, a pallet, and pH-sensitive paper. You can easily ma
Electronics Forum | Mon Mar 11 07:58:59 EDT 2013 | cyber_wolf
So I have this issue with my 1240. During my weekly oven surveyor check I get a software alarm that says I am out of tolerance. Probe #3 which is closest to the hinge side of the oven is approx. 10 degrees hotter in zone 12 than the other 2 probes o
Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
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