Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Tue Feb 17 11:27:46 EST 1998 | KME
| Do anyone know of any feeder maintenance programs, | software, etc.? We carry over 1000 Fuji feeders and | would like know what the standard is to maintain these. | Any suggestions would be helpful. | Thanks, | Reggie Aquino Reggie: Give Fuji Ame
Electronics Forum | Wed Feb 25 23:19:41 EST 1998 | Steve Gregory
Eric, You've got a Fuji FHP? WOW! It still runs even! That was the first fine pitch machine I ever worked with, along with the FEP's and CP-2's. Unless Fuji has changed the machine software, I don't know what he may be talking about. They
Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein
150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,
Electronics Forum | Fri Jan 16 23:33:32 EST 1998 | Scott
| Is there any way to implement SMT at home? | I want to assemble a prototype board of mine. | How can I hand-solder a 208-pin 0.5 mm lead | pitch PQFP -- lead-by-lead (the usual way), | or side-by-side (partial heating method)? | Alas, no SMD rework
Electronics Forum | Tue Jan 20 14:18:53 EST 1998 | Dave A
| | We are looking for a good solder/desolder machine for state-of-the-art pcb rework. | | A step up from the Pace/OK Industries is the level I am researching. | | The application is a nice R&D Lab on state-of-the art PCBs. | | Anybody who has sugges
Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef
Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen
Electronics Forum | Tue Sep 04 13:41:52 EDT 2001 | Brian W.
IPC7912 deals with the end result, ie an OEM getting boards from a contract manufacturer. I have a friend who is sitting on these committees. He tells me there is a new standard due out for actually doing in-process DPMO. From a process standpoint
Electronics Forum | Thu Aug 30 14:14:27 EDT 2001 | dougt
James Take a board with double sided tape and run it with all the other parts "shorted". Make sure that the part is being placed by the head/spindle that will be used during a full run. Inspect the part after it is placed and carefully remove it a
