Electronics Forum | Mon Dec 09 21:00:54 EST 2002 | MA/NY DDave
Hi DaveF, Well I don't agree with the process, depending on job, since the management of the workers output gets more complex. Boy would I be killed some places for writing the "No Music" policy. Personal Headphones are better than Speakers since th
Electronics Forum | Thu Dec 19 20:40:08 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Thu Dec 19 20:45:47 EST 2002 | jonfox
One common practice, depending on what is on the other side of the PCB and how much heat you need to draw away from the part, is to manufacture a pseudo-heatsink into the board itself. It looks like a large tinned pad but has a dense array of vias f
Electronics Forum | Fri Jan 17 04:07:12 EST 2003 | iman
A) Paste Printer : A1) identify the critical SMDs' pads. (choice should go to the BGA, CSP, MLF types...RES,CAP last in line...) A2) get a Paste measurement machine that measures readings of paste height (or better - volume) you are paste printing
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
Electronics Forum | Thu Jan 16 15:55:31 EST 2003 | MA/NY DDave
Hi I have a funny feeling that Mike Konrad and I know each other from IBM-Endicott days, yet I could be wrong. It would be funny?? Mike gave a good answer. The Rosin or Rosin Mildly Activated Flux (RMA) if on the board at ICT (In Circuit Test) wil
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Mon Feb 03 16:56:41 EST 2003 | jonfox
We are currently NOT using bulk, even though we looked into as a means of reducing machine time and component cost. Unfortunately, since bulk cassettes did NOT take the industry by storm as it was predicted years ago, we were stuck with long lead ti
Electronics Forum | Tue Feb 04 17:16:27 EST 2003 | jonfox
If it takes an extra step, then it is costing my company money to pay that person to do that task. Besides, I prefer to keep the stock personnel busy counting reels from shipments and preparing kits for the production floor. Kind of sounds like buy
Electronics Forum | Tue Feb 04 18:46:01 EST 2003 | slthomas
"Use the pad mating to lead wetting area." If I get your drift, we're talking about the minimum lead area (assuming the pad has an area that's at least as large as the lead) required to be wetted by IPC-610. Hmmmm...that would take some calculation
