Electronics Forum | Wed Mar 24 23:04:00 EST 1999 | Al O Owzitgon
| We are dealing with down time accredited to the Pumps getting clogged with dried glue. We have decided to purge all spindles at 6 hour intervals. We are looking at making this process automated. Has anybody tried this and if so, is there a way to s
Electronics Forum | Fri Mar 19 08:51:57 EST 1999 | Justin Medernach
| | | After rmoving a BGA (plastic)to correct unexplained shorts | | | I installed another BGA using flux only. | | | Checking on an X Ray machine and found two shorts. | | | | | | can anyone give a good explenation ? | | | | | | Thanks | | | | |
Electronics Forum | Sat Mar 13 19:34:17 EST 1999 | John W.
| | Okay, I would like to hear everyones ideas for PD naming conventions for FUJI. We are trying to use your basic names "3216_CAP" to a "MQFP208AD" But it is way out of control. Different part sizes, and vendors make it very tough to keep it all
Electronics Forum | Wed Feb 24 16:47:30 EST 1999 | Earl Moon
| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Jus
Electronics Forum | Thu Feb 18 22:49:49 EST 1999 | Chris G.
| We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board ven
Electronics Forum | Fri Jan 29 18:48:19 EST 1999 | Earl Moon
| SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All parts
Electronics Forum | Thu Jan 28 10:09:51 EST 1999 | Charles Stringer
| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g
Electronics Forum | Mon Jan 25 10:59:01 EST 1999 | Ng
| | It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not co
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
