Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Fri Sep 01 05:29:01 EDT 2017 | mona0312
Hi, Recently, i found a company called "jlcpcb". It’s very cheap 10pcs boards. 1.2mm thick, 1-OZ copper, 6/6-mil outer (0.1525mm) just cost $2 Cheap price and lots of options regarding board thickness, colour, etc. None of my boards have ever had a
Electronics Forum | Wed Jul 17 15:00:37 EDT 2013 | jmiller
what is the effect of pre-dip tank temp. and dip tank temp. on the thickness of the IAg?
Electronics Forum | Mon Aug 27 11:51:47 EDT 2012 | cobham1
Its no my turn to give some advise. My first question would be can you put the boards into a carrier of some sort. There are many wonderful companies that make carriers that are ment for running down a smt line. This can be expensive unless you order
Electronics Forum | Mon Aug 27 12:31:04 EDT 2012 | rway
Its no my turn to give some advise. My first > question would be can you put the boards into a > carrier of some sort. There are many wonderful > companies that make carriers that are ment for > running down a smt line. This can be expensive > u
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Wed Jun 02 09:55:31 EDT 1999 | Jason Gregory
Hello Dan, I have recently started using polyimide, but not for the standard uses. I designed a pallet for holding small, thin (about .0018" thick) RF boards that were being reflowed inside their aluminum housings. They were screwed down to prevent w
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