Electronics Forum | Wed Jan 25 07:18:03 EST 2017 | emeto
If you prefer to use same profile - it will be fine most of the time. There are several things to consider. 1. Is there part on second side that cannot withstand temperatures from first side? 2. If there is a high mass component on first side, that
Electronics Forum | Fri Mar 28 04:57:41 EST 2003 | emeto
more heat.But that's not correct!If convection there are air flaws and bare board has lower temperature than a board with high density.When you have elements on board you hava a vortex and the air flaw invreases the temperature.
Electronics Forum | Tue Jul 10 02:12:16 EDT 2012 | stano
Hi, when we change model from reflow temperature profile to temperature profile for glue, we always open oven to cool down. It is good for oven? Thank you for your answer.
Electronics Forum | Thu Jan 26 12:46:53 EST 2017 | dyoungquist
We run double sided boards that have large SMT electrolytic caps on the top side using the same profile for both sides. The trick is to do the bottom side first, then the top side. That way you do not need to glue down the large caps.
Electronics Forum | Tue Jan 31 08:28:29 EST 2017 | emeto
That is why we don't care if it is Top or Bottom. We call them first (process) side and second (process) side. Often you will have tall and heavy parts on both sides, so you will have to glue them.
Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376
I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven
Electronics Forum | Tue Mar 27 14:32:17 EDT 2018 | proceng1
So the first two zones come on and the last two come on, and the middle zones start dropping temperature? What happens if you let that go?
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Wed Oct 17 10:21:08 EDT 2001 | genglish
Cheers guys for your rapid response, I investigated the problem further today, eventually I cam round to curing the adhesive in a sandwich of microscope slides resting on the PCA in question (hopefully mimicking the heat transfer), the adhesive is sp
Electronics Forum | Sun Apr 25 09:45:13 EDT 1999 | Joe Cameron
Hello all, Our guys here still have some questions on the "optimized" profile which sees a more moderate ramp up straight to reflow temperatures versus the conventional profile which has a plateau at around 150 Celsius. If the optimized profile can
