Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Thu Jul 17 13:57:21 EDT 2008 | dphilbrick
The recommended bake temperature for components in Tape and Reel is 40C. If you use a bake temperature higher than that, the cover tape and other elements of the packaging will degrade to the point that it becomes impossible to reliably use an automa
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Mon Mar 16 01:57:54 EDT 2009 | ivalerio
Hi Guys Could you give me the standard criteria that is being followed for solder ball in PCBA. I am aware that we have an IPC standard but still that is generic in nature. I need a one that is applicable for automotive industry.
Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Mon Sep 09 15:38:20 EDT 2013 | action_101
For the proper baking durations for msd componrnts you should follow the ipc/jedec j-std-033b standard. Just google that standard and the pdf should come up. On page 16 there is a complete table showing the temps and durations.
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
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