Electronics Forum | Thu Nov 04 14:13:34 EST 1999 | John Thorup
Hi Tim It sort of depends on the solder alloy being used and the particular assemblies being soldered. If you are using the usual 63/37 alloy I would consider 500 to be a bit warm unless the assembly required it. Some alloys would require a higher
Electronics Forum | Tue Feb 27 07:41:15 EST 2007 | realchunks
Depending on your D.I. system, your maximum temperature concern may be at what temperture it returns to your D.I. system. Hot water may foul you set-up very quickly. As for maximum tempertures for parts, your biggest concern should be drier section
Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval
Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow
Electronics Forum | Mon Jun 09 17:41:45 EDT 2003 | davef
Welcome. You have selected a fascinating area to work. "What is delta temperature? Depends on what someone is talking about. Here's some possibilities: * In process equipment definition, the difference in temperature from one side of conveyor to
Electronics Forum | Tue Dec 17 16:33:26 EST 2002 | davef
I agree with Russ. The hand soldering temperature depends on: * What you are soldering. * What solder paste you are using. * What are the capabilities of your soldering iron. That being said, kind look at 580-650*F as kinda, sorta typical.
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Fri Nov 24 10:03:08 EST 2006 | slthomas
"The fluid sometimes heats up to 105 deg F." Not sure what you mean here...is it set at 105 but rarely gets there, or is your temperature dependant upon another process to heat it up? Also, what temp is your rinse water? We used to use a U/S clean
Electronics Forum | Wed May 28 07:44:28 EDT 2008 | rgduval
Hi, AJ, In general, the peak PCB temperature is variable depending on the profile used. We try to keep our peak temperatures in line with the paste manufacturers recommended temperatures; ignoring the peak temps for the PCBs. For the peak temps yo
Electronics Forum | Tue Aug 27 22:01:37 EDT 2002 | davef
IPC [search the fine SMTnet Archives for links] sells 7530 and other documents like it. The frequency that you check your temperature profile depends on: * Confidence that your oven is holding the profile. * Purpose of running the profile, for insta
