Electronics Forum | Tue Jan 29 21:23:55 EST 2008 | molos21
Hi everyone, Is there any instrument that you are using to measure the tensile strenght of a solder joint?. I would like to measure that from smd and thru hole parts. I just want to take a few samples to verify the mechanical properties. Thanks
Electronics Forum | Wed Nov 26 09:16:59 EST 2008 | barryg
Hello everyone, after a short layoff I am glad to be back. I have a question. I have a button (snap button) that is being soldered to a strip of sac coated copper. We are questioning the joint strength of this from our vendor as we see these popping
Electronics Forum | Tue Mar 22 07:39:05 EST 2005 | davef
There is no standard. This is a relative test. If you wish to do tests of this kind, we suggest to pay attention to the following points: * Shear strength of soft solder depends on the deformation speed applied. The faster the material is deformed t
Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia
Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.
Electronics Forum | Mon Apr 04 17:32:07 EDT 2005 | toromaster
we also have a need to measure the solder bond strength of our gull wing parts on our pwb. there are many published comparisons between eutectic SnPb and no Pb solders out there. the number that comes to mind is about 10N to 15N. I have not looked
Electronics Forum | Tue Mar 22 03:23:10 EST 2005 | EA
Hi, We are trying to break a component ( SMT component ) off the printed circuit board and measure the quality of the solder joint. But, after breaking off and having the reading, we do not know whether the reading is it within the component specifi
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Thu Mar 24 19:17:43 EST 2005 | EA
Hi, We are running the automotive product and question was throw to us how do we ensure that our solder joint are good enough after reflow.....and during the sealant process, there's a bit of bend on the nozzle and it toughes the component and custo
Electronics Forum | Wed Mar 30 16:46:03 EST 2005 | chunks
There is no spec because solder is designed to provide an electrical connection not a mechanical connection to hold the part on. If it where mechanical we�d be welding our parts on. Your pad width and length are derived from your component manufact
Electronics Forum | Mon May 11 12:15:46 EDT 2009 | jorge_quijano
Hi, I just want to know how to measure the strength of a 0603 after it's cured, we are using Heraeus PD944 with a 30-7 mils stencil, glue depositions looks well, but I don't know how to measure it? Thanks
