Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling
Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a
Electronics Forum | Wed Aug 09 16:30:43 EDT 2000 | MarkS
Has anyone had (successful) experience placing testpoint vias under BGAs? We already have conventional vias, but we're contemplating converting them into testpoints (probably by enlarging the bottom-side copper diameter to .036" and opening the bott
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F
Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side
Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef
First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate
Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya
Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Fri Nov 23 15:46:06 EST 2007 | mika
Question: We have an issue right know on a prototype batch with via in the pad on an very small pcb 50x50mm (in a panel of course). The designer has no room to move the vias as they said. The pcb is to packed with components also 8-layers. It is also
