Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John
Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su
Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Wed Jul 07 13:41:42 EDT 1999 | Dave F
snip | | If you go for plugging be sure you have a protrusion spec that you can live with. This often results in little bumps of epoxy that can interfere with component placement. For us, tenting .015 vias usually gets us about 80% coverage from
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
.gif)
