Electronics Forum | Thu Sep 21 10:34:20 EDT 2006 | Kerwin Hooshey
Is there an ICT probe style that can pierce through tented (closed) via's?
Electronics Forum | Tue Jan 31 15:52:39 EST 2006 | russ
I have never related Solder mask layout to Black Pad. I don't see how they could be related but.......
Electronics Forum | Wed Feb 01 08:20:04 EST 2006 | Chunks
Can you post the site where you saw this? I've never heard of such a thing.
Electronics Forum | Wed Feb 01 16:04:10 EST 2006 | russ
Yes it does doesn't it! I wonder how this can cause black pad. Can you contact Saturn and ask them specifically? I browsed other PCB MFGrs. for this type of info and cannot find anyone else who claims this.
Electronics Forum | Thu Aug 20 04:37:03 EDT 2009 | sergey2007
Hi, I also paid attention on the solder balls.. I thought it was because of the pop-corning, but the customer told me the component was not damaged.. Regarding the bunch of tented vias, I need to ask the customer about that. Probably, they have unpo
Electronics Forum | Sun Nov 24 20:43:15 EST 2019 | sssamw
If you want to check if solder mask on tented via, better to do cross section to have a clear view. Sometime supplier will not tell you the truth once you ask question for potential quality issue.
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling
Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a
Electronics Forum | Wed Feb 20 16:52:11 EST 2008 | pms
Yea, I'm still here.....sigh. Got bridging problems. These assemblies are SMT topside, then go thru wave for thru-hole components on topside. These assemblies have many, many, many vias VERY close together. We have a problem with solder from the wa
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