Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Jun 21 14:55:27 EDT 1999 | JohnW
| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w
Electronics Forum | Thu Jun 17 19:52:57 EDT 1999 | Tony
| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w
Electronics Forum | Thu Jun 17 20:35:51 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
Electronics Forum | Thu Jun 17 15:18:54 EDT 1999 | Earl Moon
| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.
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