Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze
Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr
Electronics Forum | Tue Feb 21 16:39:03 EST 2017 | ltchsze
Thanks for input, dyoungquist. The condition here is without any flux or paste applied. Solder from component terminal started splashing by itself when put through re-flow.
Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.
It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le
Electronics Forum | Thu Jan 20 11:16:51 EST 2000 | Wolfgang Busko
Erico:I can�t even imagine what this line looks like and what it has to do with the soldering problems without having a look at it. Also the restriction to touchup only is somewhat irritating to me. The only thing that I can think of is that in your
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Wed Jan 19 02:00:36 EST 2000 | erico
Hi wolfgang, I think Pc is not talking about the tombstone cause this terminal lifted is different from tombstone. The terminal of chip is still there but can not be solder anymore so we have to replace the chip. I also facing this problem. So can yo
Electronics Forum | Wed Jan 19 08:40:53 EST 2000 | Wolfgang Busko
Hi Erico, I think it�s just a naming problem. Under the topic of tombstone there are a lot of causes for different appearances of this symptom. Shouldn�t be always the errected position that occurs. In your case it seems that either the components so
Electronics Forum | Wed Jan 19 11:52:34 EST 2000 | Dave F
PC and Erico: Are yinns talking: 1 A component that will not lie flat on the board? 2 A component that will lie flat to the board that you can't get to solder to the pad? 3 A pad that is no longer attached to the board? 4 Something else. Whazit?
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
