Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
Electronics Forum | Mon May 12 22:40:19 EDT 2003 | nyazga
I have always heard to use solder with 2 percent silver to reduce gold embrittlment. One vendor site said this is a myth. Does anyone know of a specific document recommending this such as IPC or MIL spec. ???
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef
We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.
Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
