Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Thu Apr 26 11:40:10 EDT 2007 | CL
Good Morning, We have a 3D solder paste inspection machine. We purchased it on a recommendation from a consultant. We are a CM high mix low volume. The President of my company has attended some seminars and meetings where it was conveyed to her that
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
Electronics Forum | Wed Oct 10 17:56:35 EDT 2001 | seand
Hello all, My respone here is to add options for evaluation for the engineer. Not to convey that they are the only options as that would be reckless. Cyberoptics does have a standard line of machines configured for in line paste inspection. Some
Electronics Forum | Mon Oct 08 02:12:21 EDT 2001 | george
I do not doubt about the power of the 552 and 580, but in some cases it may be overdone. For just a simple (straight forward) shear test, you can also look at: http://www.chatillon.com/products/dpp.html (�Low Capacity Mechanical Force Gauge. These er
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Thu Aug 30 22:36:36 EDT 2001 | davef
While I don't understand why, this topic comes-up fairly often on SMTnet. [That the topic recurs indicates there truely is a problem and I'm just too doopy to understand it.] Several things: 1 Check the fine SMTnet Archives. 2 Some glue suppliers kn
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
