Electronics Forum | Thu Jan 21 19:38:24 EST 1999 | dean
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon
| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an
Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.
| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so
Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea
| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin
Electronics Forum | Sat Jan 03 17:43:31 EST 2009 | proy
Hi Wondering if anyone here is/are filemaker Pro users? I am writing a simple data collection program in Filemaker for pre-solder, pre-test inspection to replace paper sheets. Together with wireless touchscreen tablets I think this is going to be
Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd
I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350
Electronics Forum | Wed Aug 12 18:26:16 EDT 2020 | SMTA-64387117
Looking for engineers to test new desiccant technology and compare with Silica Beads. Samples provided. Additionally, engineer can work with and collaborate with "engineers only" group lead by US Military engineer for packaging. The goal is to d
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
Electronics Forum | Thu Jun 05 16:58:16 EDT 2014 | proy
I would love to use my old zevatech with a large nozzle (qfp) to pick kapton masking dots and place them on a board. I am getting some 'thicker' kapton dots to test, and need to find a way to present them, might be a trick but worth a try. Has anyon
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
