Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House
Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S
Electronics Forum | Fri Aug 20 13:36:46 EDT 2004 | ttye01
We conduct temperature stress test (-40 to +100C)on our products which sits on our expensive test board. This stress test on our product shorten the life span of the test board due to the extreme temperature change. I have tried epoxy coating on the
Electronics Forum | Sun Aug 22 22:31:31 EDT 2004 | ttye01
Hi Dave, Thanks for the input. Will certainly take your advice. Thomas
Electronics Forum | Thu Feb 11 20:38:47 EST 2016 | davef
Try: * J-STD-003 “Solderability Tests for Printed Boards” * IPC-4555 OSP Finish Specification
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv
Electronics Forum | Mon Mar 14 08:14:18 EDT 2011 | ssager
I am looking for an individual or a company that is capable of designing a function test for a simple board. Anyone have any suggestions?
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
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