Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Tue Oct 26 17:01:08 EDT 2004 | Mike
Hi Guy's thank you for the Info, This is a New Assembly house that our OEM has Moved to and they have not been very open in discussing this issue other than they are telling us this is board related. I have ask for samples of faild product with th
Electronics Forum | Wed Jan 04 09:05:53 EST 2006 | stepheniii
Your process makes a bigger difference. What I have seen is ICT done early is better than AOI done more than a half shift later, and AOI done early is better than ICT done more than a half shift later. For high mix/low volume, I would go with AOI whi
Electronics Forum | Wed Dec 23 15:35:18 EST 2015 | taborheiking
So I'm in Maintenance and I've been getting a lot of component feeder magazines back that have faulty circuit boards etc and I was wondering if there was anyone out there who has made a desk top test fixture for any of the Agilis or TMD Magazines or
Electronics Forum | Mon May 27 18:51:17 EDT 2002 | harotec
Hi Yngwie Have you got a reflow oven yet. If not, forget about complicated profiling with test runs or reflow trackers. We've got a nice oven with integrated temperature-feedback system. You build any profile you want and the oven will adjust its hea
Electronics Forum | Mon Apr 23 20:33:37 EDT 2001 | davef
I agree that solderability is THE issue, but we choose not to get into that pissin' contest. [We don't like the selected test method, either.] We believe that our coating thickness spec provides: * Solderability level that we seek. * Repeatable tes
Electronics Forum | Tue Apr 24 12:44:11 EDT 2001 | Steve
Take a look at J-STD-003, Solderability Tests for Printed Boards. This may help you create a procedure.
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Mon Feb 23 17:51:55 EST 2009 | ldavis
Chet, We've found the exact opposite. Boards we process in VP are cleaner than convection. Sorry but I cannot provide any meaningful data to back that up though. We conduct SIR testing internally using our high impedance pcba's.
