Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
Electronics Forum | Thu Jul 27 15:59:36 EDT 2006 | russ
test at the bare board level consists of opens and shorts. It makes sure that all traces are hooked (connected) up to the appropriate place and they are not shorted to a non common conductor. Russ
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Fri Apr 29 09:08:45 EDT 2005 | davef
We call this the "orange stick test", but who's coloring? In preforming the test, you're supposed to use a light touch. Unfortunately, it's difficult to calibrate a "light touch." So, operators often end-up using too much force when probing or usi
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv
Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper
Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
Electronics Forum | Tue May 26 23:42:20 EDT 2020 | smiran082
Hello, I am having trouble the QSV-1 PNP machine. On boot it had trouble connecting to the RT computer as it was hung on a message saying something along the lines of, "Establishing connection to RT computer". After several restarts we still could
