Electronics Forum | Thu May 24 19:19:20 EDT 2001 | davef
Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Mon Jul 07 09:47:50 EDT 2008 | davef
Dye & pry test reveals the solder connections that have failed prior to performimng the test.
Electronics Forum | Wed Oct 17 12:46:55 EDT 2001 | rholland
Does anyone know of an IPC standard callout for testing traces and there connection to pads or vias of manufactured PCB's? I believe it should be on the Fab drawing. At this time we ask for the test on our P.O.'s. Test Voltage (XX)V Single Sides Te
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Wed Dec 21 09:19:25 EST 2005 | rsmith
The garment test standard is ESD STM 2.1. It states that point to point and sleeve to sleeve resistance tests should be made. The electrical integrity of the seams is critical and will be verified by these tests. When you conduct a sleeve to sleeve t
Electronics Forum | Wed Sep 05 10:13:21 EDT 2007 | slthomas
When I worked for a med. device company it was always great fun to observe the UL testing. Everyone would gather around the stairwell and say bon voyage to an $8k piece of gear. This was NOT a test of the mechanical strength of soldered connections
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
