Electronics Forum | Tue Jul 15 18:44:20 EDT 2003 | davef
Sam says, �The only question remaining to me is that why the failure happened after 48 hours instead of immediate failure after soldering.� Let�s recap: * Had good-looking solder flow. * Passed the initial electrical test. * Failed the later electri
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
Electronics Forum | Tue Jun 07 19:04:07 EDT 2022 | proceng1
IF the two are identical, swap the suspected bad one (#2) position 1, and see if the fuse blows before connecting the second one. Basically the same test process you describe, but swap the units first. See if the problem follows the card, or stays
Electronics Forum | Sun May 30 22:59:29 EDT 2004 | snmsmt
I assume your talking about the forward voltage (Vf) of the LED during operation? (Probably not the correct forum for this question but anyway...) My understanding is that 'Vf' is measured during the LED's operation at a forward current ('If') of 20
Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06
I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but
Electronics Forum | Thu Sep 20 15:02:36 EDT 2007 | pjc
You do not always need test points designed on the board. Any ICT supplier will consult with you on that and after looking at your designs. Teradyne offers new and refurb'd systems for ICT, analog only or w/ Vectorless testing to ensure ICs have a co
Electronics Forum | Sun Sep 03 10:05:36 EDT 2017 | unisoft
Hi Unisoft's ProntoGERBER-CONNECTION should help you. ( http://www.unisoft-cim.com/gerber_connection.htm ) -------------- ProntoGERBER-CONNECTION ( http://www.unisoft-cim.com/gerber_connection.htm ) imports raw Gerber data and allows the user to ad
