Electronics Forum | Thu Sep 14 19:44:25 EDT 2000 | Brian W.
I cannot give references to papers, etc, but I can tell you from experience that High Impedance circuits and High Power RF circuits are not something to try no-clean on. For an aerospace customer, I had a circuit that any residue left between two pa
Electronics Forum | Fri Jul 04 21:09:04 EDT 2003 | ramanandkini
I have a CEM-1 PCB board with 35 microns copper. This is PCB is finished with SMOBC+HALS. We do solder SMT LEDs, but till date we do not have problems that you have listed. The LEDs are good & bright. It even passed high & low temp cycle tests (-40 t
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Thu Feb 27 18:07:13 EST 2014 | emesystems
The ISL12020 real time clock comes in a 20 lead DFN, and includes a 32kHz crystal in the package. The terminals of the crystal and oscillator come out to external pads and are highly susceptible to leakage to the neighboring power supply pins. With
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis
| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys
Electronics Forum | Tue Nov 05 10:55:41 EST 2019 | engmagana
Hi Ameen, Did you fix it? I had the exact same problem with the same type of coil , check the images , LF solder SAC305, we have adjusted the solder apertures to the minimum solder required to have a strong joint enough to break the pad from the bo
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Fri Oct 15 08:01:05 EDT 2004 | jmedernach
Hi Matt, You've got an interesting problem. Sounds like something from an X-Files episode but it's still interesting. In your posting, you say that the paste is "there" after screen printing. Release isn't the greatest with a 0.012" round aperture
Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen
I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w
