Electronics Forum | Wed Jan 04 14:59:41 EST 2006 | AOI
I have used all of test and inspection techniques available out there: AOI, AXI, Flying Probe, ICT, and FCT. The reality is that they all have a place in manufacturing based on the type and complexity of product you bild, the industry it is intended
Electronics Forum | Thu Nov 23 09:41:36 EST 2006 | Jon
The DPMO is a far better measure - first pass yield doesn't give you any indication on quality or effectiveness of test step. If you want 100% first pass yield, test nothing - works every time - you see where I am coming from..........
Electronics Forum | Fri Nov 13 06:56:37 EST 2009 | CL
Good Morning, The customer is looking for void free connections. They had never specified an acceptable percentage. We are reacting to the test yield. Our yield has averaged 50%. We do not test the product so we rely on feeback from the customer. Us
Electronics Forum | Thu Jul 09 00:15:39 EDT 2009 | jan_mancelita
Hi, do you know where and how we can tests 0402 ceramic capacitors? We would like to test them individually before we place them on our board; so as to get some test yield and the distribution of the parameters of this component based on the publish
Electronics Forum | Thu Jul 18 12:33:21 EDT 2002 | slthomas
Not sure if you're trying to improve your defect rate (we use dpmo) or your test yield. The question is what do you do if you're happy with your dpmo levels but not some of your first pass yield numbers because certain boards have more parts. Inspe
Electronics Forum | Mon May 07 18:30:23 EDT 2001 | genny
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and
Electronics Forum | Mon Jun 18 16:13:47 EDT 2001 | calipso
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and i
Electronics Forum | Tue Dec 28 20:31:48 EST 1999 | Jim
Justin, I have a customer who is considering changing from TH to SMT, but his preliminary reliability testing yielded solder joint failures, because his product must endure severe temperature swings. He can't change to an expensive substrate, or he'
Electronics Forum | Thu Dec 18 17:10:01 EST 1997 | Tom Volker
I am designing an SMT pad for a ss metal switch. Finished copper thickness is .0014 and nickle-plating originally is 150 millionths. Initial testing yields 100,000 to 150,000 switches before intermitent failures (copper is reached.) I want 500,000
Electronics Forum | Mon Aug 27 08:08:20 EDT 2012 | rgduval
An ICT solution seems to be overkill for what you've described. What kind of volumes are you hand building? How many components are not marked? What is your current yield with the process you are using? What is/was your yield prior to implementing m
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