Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Fri Apr 30 16:51:57 EDT 2004 | davef
This issue is not "testability of OSP board". It is "testability of nc flux residue". Kester [or some other flux suppler] can probably recommend a flux residue that is more probeable. We have talked about the problems with probes getting gummed-up
Electronics Forum | Sat May 01 07:32:29 EDT 2004 | davef
Just to be use that we're heading in the correct direction, you're probing solder, not copper, correct?
Electronics Forum | Sun May 02 10:25:31 EDT 2004 | Bryan She
I'd thought that the solder on test pad can benefit our ICT,but in fact,the residue issue arised.I'd like to know how do you test your OSP board? Thanks Bryan
Electronics Forum | Sun May 02 16:57:09 EDT 2004 | davef
You're correct. We prefer to probe solder, rather than copper, because the solder absorbs the impact of the probe better than copper and so, helps preserve the life of the probe. Beyond that, OSP has a limited "shelf life". If the OSP is not coate
Electronics Forum | Thu Jul 08 08:28:21 EDT 2004 | davef
While not a standard on the scale of A-610, consider: SMTA Testability Guidelines - TP-101C
Electronics Forum | Mon Apr 16 17:36:25 EDT 2001 | steveb
Does anyone know of a reason, other than visual, contact, or testability, for cleaning a no-clean residue off a board? Are there any SIR or long term reliability advantages to cleaning a no-clean residue?
Electronics Forum | Tue Aug 22 16:51:04 EDT 2000 | Dr. Ning-Cheng Lee
Yes, no-clean is more of a challenge, particularly for halide-free no-clean. Requirement on probe testability will make it more difficult.
Electronics Forum | Tue Dec 19 23:09:25 EST 2006 | laxminarayana pai
Well, you need to change your solder paste.There are pastes available in the market which are meant for ICT pin testability.